Two-component dielectric insulating silicon gel SI8606
∎Typical Applications
●Power semiconductors, electronic sensors, automotive ECU integrated modules and other packaging and protection IC chips, submarine fiber encapsulation, etc.
∎Product Description
SI 8606 It is a transparent two-component self-healing silicone gel, which becomes a special soft material with buffer and automatic recovery after curing.
Used to isolate moisture and other harmful contaminants from contacting the circuit board, and provide an insulator for high voltage. Another use is to provide stress relief to protect circuits and interconnectors from high temperatures and mechanical stress.
∎Key Features
- 1:1 addition molding, strong viscosity.
- High elongation; excellent flexibility, eliminate mechanical stress
- Very low oil permeability after curing,excellent resistance to poisoning
- Excellent electrical insulation at high temperature, providing protection against high voltage
- Long-term use temperature range -50-220℃ 6. Excellent aging resistance and weather resistance.
7.Excellent waterproof, anti-corrosion, moisture-proof, chemical-resistant properties
8. Can be used for semiconductor modules, sensors, etc
∎Technical Data Table
PROPERTY
|
STANDARD/UNITS
|
VALUE of SI8606
|
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|
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PART A
|
PART B
|
Material
|
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|
Polysiloxane
|
Hydrogen-containing polysiloxane
|
Color
|
Visual inspection
|
Colorless Liquid
|
Colorless Liquid
|
Viscosity
|
25°C, cps
|
650
|
560
|
Density
|
25°C, g/cm3
|
0.99
|
0.99
|
Mixture/mass ratio
|
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|
A:B=100:100 weight ratio
|
Viscosity of mixture
|
25°C, cps
|
600
|
Operation time
|
25°C, min
|
30Mins 25℃
|
Cure condition
|
RTV
|
25℃, 24hrs
or 80℃, 30mins
|
Cured appearance
|
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|
transparent gel
|
Penetration
|
1/10mm
|
66
|
Thermal Conductivity
|
W/m.k
|
0.22
|
Dielectric strength
|
KV/mm
|
25
|
Volume resistance
|
DC500V, ohm-cm
|
1.0×1015
|
Loss factor
|
1 MHz
|
<0.001
|
Dielectric constant
|
1 MHz
|
2.8
|
Operating temperature range
|
°C
|
-60~260
|
Long-term use temperature range
|
°C
|
-50~220
|
Note:All above data were tested under standardized condition, or tested by further experiments.
∎Packing Specification
●Part A—10 KG/Pot
●Part B—10 KG/ Pot
20Kg per set
∎Transport &Storage
● This product should be stored in a cool and dry environment below 25℃, and the storage period of A/B below 25℃ is 1 year.
● Products exceeding the storage period should be tested and confirmed for abnormalities before use.
● Such products are non-dangerous goods and can be transported as general chemicals. Be careful of leaks during transportation!
.∎Directions for Use
Operation process
● Weigh A and B components in the ratio of 1:1, mix evenly, and directly inject into the components (or modules) to be potted and protected.
● The potted components can be left to stand and can be heated and cured (at 80 ℃, it takes about 30 minutes), or they can be cured directly at room temperature, which takes about 24 hours.
Precautions
●Vacuum defoaming of AB components after mixing can improve the performance of hardened products
●Components A and B should be sealed and stored after being taken
●Too low temperature will lead to slow curing speed, it is recommended to heat and cure BeGel 8606 is difficult to harden in contact with sulfur, amine and tin materials
∎Attention of operation
●Keep away from Children
●Avoid contact with eyes and skin. If contact with your skin, scrub first with soap water or alcohol, then rinse with water. If contact with your eyes, rinse with plenty of water, and seek medical treatment immediately.
● It is forbidden to build on the surface of the wet substrate.